米红林,何小元.基于电子剪切散斑法的塑封材料的无损检测[J].包装工程,2011,32(5):29-31,48.
MI Hong-lin,HE Xiao-yuan.Nondestructive Examination of Plastic Sealing Materials by ESSPI[J].Packaging Engineering,2011,32(5):29-31,48. |
| 基于电子剪切散斑法的塑封材料的无损检测 |
| Nondestructive Examination of Plastic Sealing Materials by ESSPI |
| 投稿时间：2010-10-10 修订日期：2011-03-10 |
| DOI： |
| 中文关键词: 无损检测 电子剪切散斑法 塑封材料 |
| 英文关键词: nondestructive test electronic shear speckle pattern interferometry (ESSPI) sealing plastic material |
| 基金项目:上海市教育委员会一般项目（060Z028） |
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| 中文摘要: |
| 为检测轻工业产品的密封性能，应用电子错位散斑法对密封盖、药用密封装置以及食品塑封进行了检测。结果表明：电子错位散斑法能够较好地识别不同密封装置，不同部位，大小、形状各不相同的缺陷，迅速准确地对塑料密封结构质量做出判断；该方法操作简便，对缺陷部位敏感，能够较好地应用于实际现场测试。 |
| 英文摘要: |
| In order to test the sealed performance of plastic product for light industry, sealed cap, medical sealed device and sealed part for food plastic bag were tested by ESSPI technique respectively. The results showed that deflects of different sealed devices, different parts, dimensions, and shape can be identified by ESSPI method. Simultaneously, this technique is convenience for operation and is very sensitive to the deflective parts. ESSPI method can be used in nondestructive test on spot. |
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