杨 华,刘 真.基于v4插值算法的墨量在线检测研究[J].包装工程,2011,32(17):102-104.
YANG Hua,LIU Zhen.Research on Ink On-line Testing Based on v4 Interpolation Algorithm[J].Packaging Engineering,2011,32(17):102-104. |
| 基于v4插值算法的墨量在线检测研究 |
| Research on Ink On-line Testing Based on v4 Interpolation Algorithm |
| 投稿时间：2011-05-20 修订日期：2011-09-10 |
| DOI： |
| 中文关键词: 墨量检测 墨层厚度 v4插值算法 |
| 英文关键词: ink testing ink film thickness v4 interpolation algorithm |
| 基金项目: |
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| 中文摘要: |
| 采用IGT模拟平版印刷的实验，建立了3种墨层厚度与光学密度的转换模型，依据模型的MAE和RMSE值，采用T-E模型，获得了多种油墨纸张组合的最佳墨层厚度范围。通过v4插值算法建立了CCD响应值与墨层厚度范围的三维模型，以实现墨量在线检测，并以测试样张的CCD响应值是否对应于最佳墨层厚度范围，验证了模型的准确性。 |
| 英文摘要: |
| Three kinds of ink film thickness and optical density conversion model were established through simulating offset print with IGT. According to the MAE and RMSE values, by using Tollenar-Erns model, the best range of ink film thickness of different paper and ink's combination were solved. A three dimensional model of CCD signal acquisition values and ink film thickness was set up by using v4 interpolation algorithm to realize ink on-line testing. The model's accuracy was validated by testing sample's CCD signal acquisition values on the correspondence to the best range of ink film thickness. |
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