李晓敏,赵秀萍.RFID 电子标签 Inlay封装工艺参数优化试验[J].包装工程,2014,35(13):81-84,92.
LI Xiao-min,ZHAO Xiu-ping.Optimization Tests of the RFID Tag Inlay Packaging Process Parameters[J].Packaging Engineering,2014,35(13):81-84,92. |
| RFID 电子标签 Inlay封装工艺参数优化试验 |
| Optimization Tests of the RFID Tag Inlay Packaging Process Parameters |
| 投稿时间：2014-04-03 修订日期：2014-07-01 |
| DOI： |
| 中文关键词: RFID 标签 封装 工艺参数 优化试验 |
| 英文关键词: RFID tag packaging process parameters optimization tests |
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| 中文摘要: |
| 目的 研究 RFID 标签Inlay封装工艺对标签质量的影响。 方法 主要讨论Inlay封装过程中的点胶工艺、拾晶工艺、热压固化工艺等对封装质量的影响， 着重研究热压固化工艺参数对封装质量的影响， 主要因素有热压应力、热压温度、热压时间等， 热压应力设定为 3， 3.5， 4 MPa， 上下加热头的热压温度设定为 160/150 ℃， 170/160 ℃， 180/170 ℃， 热压时间设定为 10， 12， 14 s， 建立三因素三水平的正交试验做对比。 结果 在电阻、读写情况均正常的情况下， 把剪切强度作为评价指标， 发现不同组合的封装参数， 剪切力差异很大。 结论 通过实验对比和分析得出最佳的热压固化封装参数组合： 热压应力为 3.5 MPa，热压温度为 180/170 ℃，热压时间为 10 s。 |
| 英文摘要: |
| Objective To study the effects of the RFID inlay packaging process on the quality of the label． Methods The effects of dispensing technology， crystal picking technology， hot pressing and curing technology in the dispensing process on the quality of the tag were discussed． The key study was the parameters of hot pressing and curing technology including hot-pressing stress, hot-pressing temperature and hot-pressing time． The hot-pressing stress was set at 3, 3.5, 4 MPa, the hot-pressing temperature was set at 160/150 ℃ , 170/160 ℃ , 170/160 ℃ , and the hot pressing time was set at 10, 12, 14 s. Orthogonal tests with three factors and three levels were used to optimize the tests. Results Under the normal conditions of resistance and RW, by measuring the shear strength, we found that different combinations of parameters led to different shear stress. Conclusion Through experimental contrast and analysis, the best thermal curing parameter combination was obtained: hot-pressing stress 3.5 MPa, hot-pressing temperature 180/170 ℃， hot pressing time 10 s. |
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