金文君,冯晓龙,杨操,刘文涛,陈金周,黄灵阁.铜基无颗粒型导电墨水的性能研究[J].包装工程,2017,38(13):113-117.
JIN Wen-jun,FENG Xiao-long,YANG Cao,LIU Wen-tao,CHEN Jin-zhou,HUANG Ling-ge.Properties of Copper-based Particle-Free Conductive Ink[J].Packaging Engineering,2017,38(13):113-117. |
| 铜基无颗粒型导电墨水的性能研究 |
| Properties of Copper-based Particle-Free Conductive Ink |
| 投稿时间：2016-10-16 修订日期：2017-07-10 |
| DOI： |
| 中文关键词: 导电墨水 醋酸铜 无颗粒型 化学还原法 煅烧 |
| 英文关键词: conductive ink copper acetate particle-free chemical reduction method calcination |
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| 中文摘要: |
| 目的 通过测定导电涂层电阻率来确定导电墨水的最佳制备工艺参数。方法 以醋酸铜为前驱体，N,N-二甲基乙醇胺为络合剂，甲酸为还原剂，制备导电性高的铜基无颗粒型导电墨水。采用化学还原法制备铜基无颗粒型导电墨水，通过正交实验研究烧结温度、烧结时间以及Cu2+∶H+∶NH4+的比例对涂层导电性的影响，确定最佳的制备工艺。结果 制备的铜基无颗粒型导电墨水在弱碱性环境下较稳定，墨水中的Cu2+, H+, NH4+的最佳物质的量之比为1∶3∶3。该配方的墨水具有很高的稳定性能和导电性能，在玻璃基材上滴涂经160 ℃下热处理30 min，得到的涂层电阻率仅为0.18 μΩ•m。结论 初步实现了铜基无颗粒型导电墨水的低温烧结。 |
| 英文摘要: |
| The work aims to determine the best preparation process parameter of the conductive ink by measuring the resistivity of conductive coating. Taking copper acetate as precursor, N,N-Dimethylethanolamine as complexing agent, and formic acid as reductant, the copper-based particle-free conductive ink of high conductivity was prepared. Copper-based particle-free conductive ink was prepared in chemical reduction method. The influence of the sintered temperature and time, and the ratio of Cu2+∶H+∶NH4+ on the coating conductivity was studied through orthogonal experiment to determine the best preparation process. The copper-based particle-free conductive ink with the optimal mole ratio of Cu2+∶H+∶NH4+ in the ink of 1∶3∶3 was stable in weak alkaline. The ink with optimal formula possessed high stability and conductivity. With the ink dropped and applied on the glass substrate to be cured for 30 min at 160 ℃, the coating resistivity obtained was only 0.18 μΩ•m. In conclusion, the low-temperature sintering of copper-based particle-free conductive ink is primarily achieved. |
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