| 摘要: |
| 目的 研究硅烷偶联剂KH550含量对木粉/P34HB复合包装材料性能的影响。采用KH550改性木粉，提高与聚（3-羟基丁酸酯-4-羟基丁酸酯）（P34HB）的结合强度，改善复合材料的力学性能和界面相容性。方法 以KH550为改性剂，木粉和P34HB为原料，利用共混热压工艺制备改性木粉/P34HB复合材料；通过对复合材料的形貌进行观察，以及傅里叶变换红外光谱（FTIR）、热重分析（TGA）和力学性能分析，研究KH550质量分数不同时对复合材料界面相容性、力学性能和热性能的影响。结果 添加KH550后，复合材料的的界面相容性得到改善；FTIR分析表明，KH550已经成功接枝到木粉中；适量的KH550提高了复合材料的热稳定性；复合材料的储能模量增加；复合材料的力学性能也有所提高。此外还得到了最佳的KH550添加量，即质量分数为0.5％。结论 KH550不仅使得木粉与P34HB的相容性得到改善，同时也增强了复合包装材料的力学性能和热性能。 |
| 关键词: KH550 复合包装材料 力学性能 相容性 |
| DOI：10.19554/j.cnki.1001-3563.2019.21.009 |
| 分类号:TB484.2 |
| 基金项目:天津市自然科学基金（18JCYBJC90100） |
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| Preparation of Silane Coupling Agent Modified Wood Flour/P34HB Composite Packaging Material |
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ZHU Li-zi, MA Xiao-jun
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Tianjin University of Science & Technology, Tianjin 300222, China
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| Abstract: |
| The work aims to study the effect of silane coupling agent KH550 content on the properties of wood flour/P34HB composite packaging materials, increase the bonding strength of wood flour modified by KH550 with poly (3-hydroxybutyrate-4-hydroxybutyrate) (P34HB), and improve the mechanical properties and interfacial compatibility of the composites. Modified wood flour/P34HB composites were prepared with KH550 as modifier and wood flour and P34HB as raw materials by blending hot pressing process. The effects of different mass fractions of KH550 on interfacial compatibility, mechanical properties and thermal properties of composites were studied by morphology observation, Fourier transform infrared spectroscopy (FTIR), thermal analysis (TGA) and mechanical properties analysis. After the addition of KH550, the interfacial compatibility of the composites was improved. FTIR showed that, KH550 had been grafted into wood flour; the proper amount of KH550 improved the thermal stability of the composite; the storage modulus of the composite increased; and the mechanical properties of the composite were also improved. In addition, the best addition amount of KH550 was obtained, and the mass fraction was 0.5%. KH550 not only improves the compatibility of wood flour with P34HB, but also enhances the mechanical and thermal properties of composite packaging materials. |
| Key words: KH550 composite packaging materials mechanical properties compatibility |
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