文章摘要
宁廷州,付玲,张敬芝.电器封装用高效导热/阻燃环氧复合材料的制备[J].包装工程,2020,41(3):156-163.
NING Ting-zhou,FU Ling,ZHANG Jing-zhi.Preparation of Epoxy Composites with Highly Efficient Thermal Conductivity/Flame Retardancy for Electrical Packaging[J].Packaging Engineering,2020,41(3):156-163.
电器封装用高效导热/阻燃环氧复合材料的制备
Preparation of Epoxy Composites with Highly Efficient Thermal Conductivity/Flame Retardancy for Electrical Packaging
投稿时间:2019-11-12  修订日期:2020-02-10
DOI:10.19554/j.cnki.1001-3563.2020.03.024
中文关键词: 原位聚合法  石墨烯  磷烯  热线法  锥形量热
英文关键词: in-situ polymerization  graphene  blackphosphorene  hot wire method  cone calorimetry
基金项目:枣庄市科技计划(2019GX10);枣庄学院博士科研启动基金(2018BS030)
作者单位
宁廷州 枣庄学院 机电工程学院山东 枣庄 277160 
付玲 枣庄学院 机电工程学院山东 枣庄 277160 
张敬芝 枣庄学院 机电工程学院山东 枣庄 277160 
摘要点击次数:
全文下载次数:
中文摘要:
      目的 为了提高电器封装材料的安全性,制备出一种具有高效导热/阻燃的环氧复合材料。方法 通过原位聚合法,采用三聚氰胺-甲醛树脂预聚体(MF)修饰石墨烯(G)/磷烯(BP)合成纳米填料,辅以环氧树脂(E51)制备高导热/阻燃的环氧复合材料。通过TGA、热线法和锥形量热法分别测试复合材料的热稳定性、导热性和阻燃性。结果 研究结果表明,当MF@BP/G的质量分数为3%时,环氧复合材料的残碳量高达22.19%,相较于纯的环氧复合材料提升了76.77%;导热系数提升至0.257 W/(m∙K),提升率为27.86%;峰值热释放率、总的热释放量、峰值烟雾释放率和总的烟雾释放量分别下降了43.76%,27.72%,46.81%和28.83%。结论 以MF@BP/G为功能填料,可以有效提高环氧复合材料的导热性和阻燃性,有利于提升环氧复合材料的使用安全性。
英文摘要:
      The work aims to improve the safety of electrical packaging materials and prepare an epoxy composite with highly efficient thermal conductivity and flame retardancy. Melamine-formaldehyde resin prepolymer (MF) was employed to modify graphene (G)/blackphosphorene (BP) to synthesize nano-filler via in-situ polymerization, and then epoxy composites with high thermal conductivity/flame retardancy were prepared with the supplement of E51. The thermal stability, thermal conductivity and flame retardancy of the composites were tested by TGA, hot wire method and cone calorimetry, respectively. The research results showed that, when the mass fraction of MF@BP/G was 3%, the residual charring rate of epoxy composites was as high as 22.19%, which was an increase of 76.77% compared with pure epoxy composites; the thermal conductivity was increased to 0.257 W/(m∙K), and the increase rate was 27.86%; and the peak heat release rate, the total heat release, the peak smoke release rate and total smoke release decreased by 43.76%, 27.72%, 46.81% and 28.83%, respectively. MF@BP/G used as a functional filler can effectively improve the thermal conductivity and flame retardancy of epoxy composites, and is conducive to improving the use safety of epoxy composites.
查看全文   查看/发表评论  下载PDF阅读器
关闭

关于我们 | 联系我们 | 投诉建议 | 隐私保护 | 用户协议

您是第22601007位访问者    渝ICP备15012534号-2

版权所有:《包装工程》编辑部 2014 All Rights Reserved

邮编:400039 电话:023-68795652 Email: designartj@126.com

    

渝公网安备 50010702501716号