文章摘要
庄明,刘正涛,黄安畏,杨九州,刘博,付扬帆,周富,詹青青,吴厦.基于数字孪生的装配技术现状及发展展望[J].包装工程,2024,45(23):258-267.
ZHUANG Ming,LIU Zhengtao,HUANG Anwei,YANG Jiuzhou,LIU Bo,FU Yangfan,ZHOU Fu,ZHAN Qingqing,WU Xia.Present Situation and Development Prospect of Assembly Technology Based on Digital Twin[J].Packaging Engineering,2024,45(23):258-267.
基于数字孪生的装配技术现状及发展展望
Present Situation and Development Prospect of Assembly Technology Based on Digital Twin
投稿时间:2024-11-22  
DOI:10.19554/j.cnki.1001-3563.2024.23.028
中文关键词: 数字孪生  装配  研究现状  发展展望
英文关键词: digital twin  assembly  research status  development prospect
基金项目:重庆英才创新领军人才
作者单位
庄明 中国国际工程咨询有限公司北京 100000 
刘正涛 西南技术工程研究所重庆 401329 
黄安畏 西南技术工程研究所重庆 401329 
杨九州 西南技术工程研究所重庆 401329 
刘博 西南技术工程研究所重庆 401329 
付扬帆 西南技术工程研究所重庆 401329 
周富 西南技术工程研究所重庆 401329 
詹青青 西南技术工程研究所重庆 401329 
吴厦 西南技术工程研究所重庆 401329 
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中文摘要:
      目的 综述国内外基于数字孪生的装配技术的发展现状,并结合制造业发展趋势及装配技术的发展脉络,对基于数字孪生的装配技术发展前景进行展望。方法 梳理了数字化装配历经的基于虚拟现实的数字化装配、基于增强现实的数字化装配、基于数字孪生的数字化装配3个发展阶段及其各自的特点,重点综述了国内外在数字孪生模型构建、孪生体仿真精度预测与控制、数字孪生装配系统开发等方面的研究进展,并对未来装配技术的发展前景进行了展望。结论 明确指出基于数字孪生的装配技术在数据准确性和完整性、时效性和系统集成与兼容性等方面还面临问题和挑战,并提出了相应的解决思路。
英文摘要:
      The work aims to review the development status of assembly technology based on digital twin in China and abroad and look forward to the development prospect combined with the trends of the manufacturing industry and the development trajectory of the assembly technology. The three development stages of digital assembly, namely, virtual reality-based digital assembly, augmented reality-based digital assembly, and digital twin-based digital assembly, were sorted out and their respective features were summarized. The research progress in the aspects of digital twin modeling, twin simulation accuracy prediction and control, and development of digital twin assembly system in China and abroad was summarized in detail, and the development prospects were put forward. It is clearly pointed out that assembly technology based on digital twin still faces problems and challenges in terms of data accuracy and completeness, timeliness, system integration and compatibility, and corresponding solutions are proposed.
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