Multiple Affective Responses Design Method of Product Based on Kansei Engineering and TOPSIS-AISM

LIU Anqi, CHENG Xufeng, WANG Mingru

Packaging Engineering ›› 2024, Vol. 45 ›› Issue (12) : 183-193.

PDF(12814 KB)
PDF(12814 KB)
Packaging Engineering ›› 2024, Vol. 45 ›› Issue (12) : 183-193. DOI: 10.19554/j.cnki.1001-3563.2024.12.019

Multiple Affective Responses Design Method of Product Based on Kansei Engineering and TOPSIS-AISM

  • LIU Anqi, CHENG Xufeng, WANG Mingru
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Abstract

The work aims to propose a product appearance design method based on Kansei Engineering (KE), Technique for Order Preference by Similarity to an Ideal Solution (TOPSIS) and Adversarial Interpretive Structure Modeling Method (AISM) to explore the transformation between consumers' multiple affective response and product appearance design. First, KE was used to obtain consumers' emotional adjectives and product sample database. Second, the distance and proximity of positive and negative ideal points in TOPSIS and close degree were used to sort and compare market styles and product design elements, and get the ranking of pros and cons. Meanwhile, the AISM was used to create topological hierarchy diagrams. Finally, the household open flame smokeless moxibustion instrument was selected as the verification object to verify the applicability of the method. The results showed that the improved product had good feedback and met the multiple affective needs of consumers. The design method based on KE-TOPSIS-AISM could extract product appearance design elements based on consumer affective data and accurately locate the design improvement points and improve the versatility of the product, so as to meet the multiple affective needs of users. It provides a new idea for the research of multiple affective response product appearance design.

Key words

product design; Kansei engineering; TOPSIS; AISM; multiple affective response

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LIU Anqi, CHENG Xufeng, WANG Mingru. Multiple Affective Responses Design Method of Product Based on Kansei Engineering and TOPSIS-AISM[J]. Packaging Engineering. 2024, 45(12): 183-193 https://doi.org/10.19554/j.cnki.1001-3563.2024.12.019
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