基于细节层次（LOD）建模的虚拟现实智能家居设计方法研究

WU Pengjun, CHEN Jiarui, XU Dandan, MO Wei, LIU Yao

Packaging Engineering . 2026, (4): 19 -29 . DOI: 10.19554/j.cnki.1001-3563.2026.04.002